<strong><span style="font-size:18px;">高性能涂层微钻在IC封装基板精密微孔加工应用研究</span></strong>

硬质合金 ›› 2023, Vol. 40 ›› Issue (5) : 335-346.

高性能涂层微钻在IC封装基板精密微孔加工应用研究

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Research on Application of High-Performance Coated Micro-Drills in Precise Micro-Hole Processing of IC Packaging Substrates

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2023, 40(5): 335-346

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